These configs are causing instability on Juno boards.

For Arm:
  Add       ARM vexpress-spc cpufreq driver
  Add       ARM Big.Little cpuidle driver
  Add       Sensor Vexpress
  Disable   CONFIG_HARDEN_BRANCH_HISTORY

* thermal: (135 commits)
  thermal/drivers/st: Remove syscfg based driver
  thermal: Remove core header inclusion from drivers
  tools/lib/thermal: Fix include path for libnl3 in pkg-config file.
  thermal/drivers/hisi: Drop second sensor hi3660
  thermal/drivers/rcar_gen3_thermal: Fix device initialization
  thermal/drivers/rcar_gen3_thermal: Create device local ops struct
  thermal/drivers/rcar_gen3_thermal: Do not call set_trips() when resuming
  thermal/drivers/rcar_gen3: Add support for R-Car V4H
  dt-bindings: thermal: rcar-gen3-thermal: Add r8a779g0 support
  thermal/drivers/mediatek: Add the Low Voltage Thermal Sensor driver
  dt-bindings: thermal: mediatek: Add LVTS thermal controllers
  thermal/drivers/mediatek: Relocate driver to mediatek folder
  tools/lib/thermal: Fix thermal_sampling_exit()
  Documentation: powerclamp: Fix numbered lists formatting
  Documentation: powerclamp: Escape wildcard in cpumask description
  Documentation: admin-guide: Add toctree entry for thermal docs
  thermal: intel: powerclamp: Add two module parameters
  Documentation: admin-guide: Move intel_powerclamp documentation
  thermal: core: Use sysfs_emit_at() instead of scnprintf()
  thermal: intel: powerclamp: Fix duration module parameter
  ...

* pm-opp:
  OPP: fix error checking in opp_migrate_dentry()
  dt-bindings: opp: v2-qcom-level: Let qcom,opp-fuse-level be a 2-long array
  drivers/opp: Remove "select SRCU"
  dt-bindings: opp: opp-v2-kryo-cpu: Add missing 'cache-unified' property in example

The syscfg based thermal driver is only supporting STiH415 STiH416 and
STiD127 platforms which are all no more supported.  We can thus safely
remove this driver since the remaining STi platform STiH407/STiH410
and STiH418 are all using the memmap based thermal driver.

Signed-off-by: Alain Volmat <avolmat@me.com>
Link: https://lore.kernel.org/r/20230209091659.1409-7-avolmat@me.com


Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>

As the name states "thermal_core.h" is the header file for the core
components of the thermal framework.

Too many drivers are including it. Hopefully the recent cleanups
helped to self encapsulate the code a bit more and prevented the
drivers to need this header.

Remove this inclusion in every place where it is possible.

Some other drivers did a confusion with the core header and the one
exported in linux/thermal.h. They include the former instead of the
latter. The changes also fix this.

The tegra/soctherm driver still remains as it uses an internal
function which need to be replaced.

The Intel HFI driver uses the netlink internal framework core and
should be changed to prevent to deal with the internals.

No functional changes intended.

Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Miquel Raynal <miquel.raynal@bootlin.com> # armada_thermal.c
Reviewed-by: Kunihiko Hayashi <hayashi.kunihiko@socionext.com> # uniphier_thermal.c
Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se> # rcar_gen3_thermal.c
Reviewed-by: Neil Armstrong <neil.armstrong@linaro.org> # amlogic_thermal.c
Acked-by: Florian Fainelli <f.fainelli@gmail.com> # bcm2835_thermal.c
Acked-by: Thierry Reding <treding@nvidia.com> # tegra30-tsensor.c
Link: https://lore.kernel.org/r/20230206153432.1017282-1-daniel.lezcano@linaro.org


Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>

Fixes pkg-config returning malformed CFLAGS for libthermal.

Signed-off-by: Vibhav Pant <vibhavp@gmail.com>
Link: https://lore.kernel.org/r/20230211081935.62690-1-vibhavp@gmail.com


Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>

The commit 74c8e6bf ("driver core: Add __alloc_size hint to devm
allocators") exposes a panic "BRK handler: Fatal exception" on the
hi3660_thermal_probe funciton.
This is because the function allocates memory for only one
sensors array entry, but tries to fill up a second one.

Fix this by removing the unneeded second access.

Fixes: 7d3a2a2b ("thermal/drivers/hisi: Fix number of sensors on hi3660")
Signed-off-by: Yongqin Liu <yongqin.liu@linaro.org>
Link: https://lore.kernel.org/linux-mm/20221101223321.1326815-5-keescook@chromium.org/
Link: https://lore.kernel.org/r/20230210141507.71014-1-yongqin.liu@linaro.org


Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>

The thermal zone is registered before the device is register and the
thermal coefficients are calculated, providing a window for very
incorrect readings.

The reason why the zone was register before the device was fully
initialized was that the presence of the set_trips() callback is used to
determine if the driver supports interrupt or not, as it is not defined
if the device is incapable of interrupts.

Fix this by using the operations structure in the private data instead
of the zone to determine if interrupts are available or not, and
initialize the device before registering the zone.

Signed-off-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Reviewed-by: Wolfram Sang <wsa+renesas@sang-engineering.com>
Link: https://lore.kernel.org/r/20230208190333.3159879-4-niklas.soderlund+renesas@ragnatech.se


Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>

The callback operations are modified on a driver global level. If one
device tree description do not define interrupts, the set_trips()
operation was disabled globally for all users of the driver.

Fix this by creating a device local copy of the operations structure and
modify the copy depending on what the device can do.

Signed-off-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Reviewed-by: Wolfram Sang <wsa+renesas@sang-engineering.com>
Link: https://lore.kernel.org/r/20230208190333.3159879-3-niklas.soderlund+renesas@ragnatech.se


Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>

There is no need to explicitly call set_trips() when resuming from
suspend. The thermal framework calls thermal_zone_device_update() that
restores the trip points.

Suggested-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Link: https://lore.kernel.org/r/20230208190333.3159879-2-niklas.soderlund+renesas@ragnatech.se


Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>

Add support for the Thermal Sensor/Chip Internal Voltage Monitor/Core
Voltage Monitor (THS/CIVM/CVM) on the Renesas R-Car V4H (R8A779G0) SoC.

According to the R-Car V4H Hardware User's Manual Rev. 0.70, the
(preliminary) conversion formula for the thermal sensor is the same as
for most other R-Car Gen3 and Gen4 SoCs, while the (preliminary)
conversion formula for the chip internal voltage monitor differs.
As the driver only uses the former, no further changes are needed.

Signed-off-by: Geert Uytterhoeven <geert+renesas@glider.be>
Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Link: https://lore.kernel.org/r/852048eb5f4cc001be7a97744f4c5caea912d071.1675958665.git.geert+renesas@glider.be


Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>

Document support for the Thermal Sensor/Chip Internal Voltage
Monitor/Core Voltage Monitor (THS/CIVM/CVM) on the Renesas R-Car V4H
(R8A779G0) SoC.

Unlike most other R-Car Gen3 and Gen4 SoCs, it has 4 instead of 3
sensors, so increase the maximum number of reg tuples.
Just like other R-Car Gen4 SoCs, interrupts are not routed to the
INTC-AP but to the ECM.

Signed-off-by: Geert Uytterhoeven <geert+renesas@glider.be>
Reviewed-by: Wolfram Sang <wsa+renesas@sang-engineering.com>
Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Link: https://lore.kernel.org/r/11f740522ec479011cc8eef6bb450603be394def.1675958665.git.geert+renesas@glider.be


Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>

The Low Voltage Thermal Sensor (LVTS) is a multiple sensors, multi
controllers contained in a thermal domain.

A thermal domains can be the MCU or the AP.

Each thermal domains contain up to seven controllers, each thermal
controller handle up to four thermal sensors.

The LVTS has two Finite State Machines (FSM), one to handle the
functionin temperatures range like hot or cold temperature and another
one to handle monitoring trip point. The FSM notifies via interrupts
when a trip point is crossed.

The interrupt is managed at the thermal controller level, so when an
interrupt occurs, the driver has to find out which sensor triggered
such an interrupt.

The sampling of the thermal can be filtered or immediate. For the
former, the LVTS measures several points and applies a low pass
filter.

Signed-off-by: Balsam CHIHI <bchihi@baylibre.com>
Reviewed-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com>

On MT8195 Tomato Chromebook:

Tested-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com>
Link: https://lore.kernel.org/r/20230209105628.50294-5-bchihi@baylibre.com


Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>

Add LVTS thermal controllers dt-binding definition for mt8192 and mt8195.

Signed-off-by: Balsam CHIHI <bchihi@baylibre.com>
Reviewed-by: Rob Herring <robh@kernel.org>
Link: https://lore.kernel.org/r/20230209105628.50294-3-bchihi@baylibre.com


Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>

Add MediaTek proprietary folder to upstream more thermal zone and cooler
drivers, relocate the original thermal controller driver to it, and rename it
as "auxadc_thermal.c" to show its purpose more clearly.

Signed-off-by: Balsam CHIHI <bchihi@baylibre.com>
Reviewed-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com>
Link: https://lore.kernel.org/r/20230209105628.50294-2-bchihi@baylibre.com


Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>

thermal_sampling_init() suscribes to THERMAL_GENL_SAMPLING_GROUP_NAME group
so thermal_sampling_exit() should unsubscribe from the same group.

Fixes: 47c4b0de ("tools/lib/thermal: Add a thermal library")
Signed-off-by: Vincent Guittot <vincent.guittot@linaro.org>
Link: https://lore.kernel.org/r/20230202102812.453357-1-vincent.guittot@linaro.org


Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>

Merge thermal control changes related to Intel platforms for 6.3-rc1:

 - Rework ACPI helper functions for thermal control to retrieve a trip
   point temperature instead of initializing a trip point objetc (Rafael
   Wysocki).

 - Clean up and improve the int340x thermal driver ((Rafael Wysocki).

 - Simplify and clean up the intel_pch thermal driver ((Rafael Wysocki).

 - Fix the Intel powerclamp thermal driver and make it use the common
   idle injection framework (Srinivas Pandruvada).

 - Add two module parameters, cpumask and max_idle, to the Intel powerclamp
   thermal driver to allow it to affect only a specific subset of CPUs
   instead of all of them (Srinivas Pandruvada).

 - Make the Intel quark_dts thermal driver Use generic trip point
   objects instead of its own trip point representation (Daniel
   Lezcano).

 - Add toctree entry for thermal documents and fix two issues in the
   Intel powerclamp driver documentation (Bagas Sanjaya).

* thermal-intel: (25 commits)
  Documentation: powerclamp: Fix numbered lists formatting
  Documentation: powerclamp: Escape wildcard in cpumask description
  Documentation: admin-guide: Add toctree entry for thermal docs
  thermal: intel: powerclamp: Add two module parameters
  Documentation: admin-guide: Move intel_powerclamp documentation
  thermal: intel: powerclamp: Fix duration module parameter
  thermal: intel: powerclamp: Return last requested state as cur_state
  thermal: intel: quark_dts: Use generic trip points
  thermal: intel: powerclamp: Use powercap idle-inject feature
  powercap: idle_inject: Add update callback
  powercap: idle_inject: Export symbols
  thermal: intel: powerclamp: Fix cur_state for multi package system
  thermal: intel: intel_pch: Drop struct board_info
  thermal: intel: intel_pch: Rename board ID symbols
  thermal: intel: intel_pch: Fold suspend and resume routines into their callers
  thermal: intel: intel_pch: Fold two functions into their callers
  thermal: intel: intel_pch: Eliminate device operations object
  thermal: intel: intel_pch: Rename device operations callbacks
  thermal: intel: intel_pch: Eliminate redundant return pointers
  thermal: intel: intel_pch: Make pch_wpt_add_acpi_psv_trip() return int
  ...

Merge thermal control core changes for 6.3-rc1:

 - Clean up thermal device unregistration code (Viresh Kumar).

 - Fix and clean up thermal control core initialization error code
   paths (Daniel Lezcano).

 - Relocate the trip points handling code into a separate file (Daniel
   Lezcano).

 - Make the thermal core fail registration of thermal zones and cooling
   devices if the thermal class has not been registered (Rafael Wysocki).

 - Make the core thermal control code use sysfs_emit_at() instead of
   scnprintf() where applicable (ye xingchen).

* thermal-core:
  thermal: core: Use sysfs_emit_at() instead of scnprintf()
  thermal: Fail object registration if thermal class is not registered
  thermal/core: Move the thermal trip code to a dedicated file
  thermal/core: Remove unneeded ida_destroy()
  thermal/core: Fix unregistering netlink at thermal init time
  thermal: core: Use device_unregister() instead of device_del/put()
  thermal: core: Move cdev cleanup to thermal_release()

* powercap:
  powercap: intel_rapl: Fix handling for large time window
  powercap: idle_inject: Support 100% idle injection
  powercap: intel_rapl: add support for Emerald Rapids
  powercap: intel_rapl: add support for Meteor Lake
  powercap: fix possible name leak in powercap_register_zone()

* pm-domains:
  PM: domains: fix memory leak with using debugfs_lookup()

* pm-em:
  PM: EM: fix memory leak with using debugfs_lookup()

* pm-tools:
  PM: tools: use canonical ftrace path

* pm-docs:
  Documentation: power: correct spelling

* pm-cpuidle:
  cpuidle: psci: Do not suspend topology CPUs on PREEMPT_RT
  cpuidle: driver: Update microsecond values of state parameters as needed
  cpuidle: sysfs: make kobj_type structures constant
  cpuidle: add ARCH_SUSPEND_POSSIBLE dependencies
  intel_idle: add Emerald Rapids Xeon support
  cpuidle-haltpoll: Replace default_idle() with arch_cpu_idle()
  cpuidle-haltpoll: select haltpoll governor
  cpuidle: teo: Introduce util-awareness
  cpuidle: teo: Optionally skip polling states in teo_find_shallower_state()

* pm-core:
  PM: Add EXPORT macros for exporting PM functions
  PM: runtime: Document that force_suspend() is incompatible with SMART_SUSPEND

* pm-sleep:
  PM: sleep: Remove "select SRCU"
  PM: hibernate: swap: don't use /** for non-kernel-doc comments

* pm-cpufreq: (26 commits)
  cpufreq: qcom-hw: Add missing null pointer check
  dt-bindings: opp: opp-v2-kryo-cpu: enlarge opp-supported-hw maximum
  dt-bindings: cpufreq: qcom-cpufreq-nvmem: make cpr bindings optional
  dt-bindings: cpufreq: qcom-cpufreq-nvmem: specify supported opp tables
  MIPS: loongson32: Drop obsolete cpufreq platform device
  cpufreq: Make kobj_type structure constant
  cpufreq: davinci: Fix clk use after free
  cpufreq: amd-pstate: avoid uninitialized variable use
  cpufreq: Make cpufreq_unregister_driver() return void
  dt-bindings: cpufreq: cpufreq-qcom-hw: Add SM8550 compatible
  dt-bindings: cpufreq: cpufreq-qcom-hw: Add missing compatibles
  cpufreq: mediatek-hw: Register to module device table
  cpufreq: tegra194: Enable CPUFREQ thermal cooling
  Documentation: amd-pstate: introduce new global sysfs attributes
  cpufreq: amd-pstate: convert sprintf with sysfs_emit()
  Documentation: introduce amd pstate active mode kernel command line options
  Documentation: amd-pstate: add amd pstate driver mode introduction
  cpufreq: amd-pstate: add driver working mode switch support
  cpufreq: amd-pstate: implement suspend and resume callbacks
  cpufreq: amd-pstate: implement amd pstate cpu online and offline callback
  ...

* acpi-cppc:
  ACPI: CPPC: Fix some kernel-doc comments

* acpi-video:
  ACPI: video: Fix Lenovo Ideapad Z570 DMI match

* acpi-misc:
  ACPI: Silence missing prototype warnings

* acpi-docs:
  Documentation: firmware-guide/ACPI: correct spelling

* acpi-pmic:
  ACPI: PMIC: Add comments with DSDT power opregion field names
  ACPI: PMIC: Add pmic_i2c_address to BYT Crystal Cove support

* acpi-battery:
  ACPI: battery: Increase maximum string length
  ACPI: battery: Fix buffer overread if not NUL-terminated
  ACPI: battery: Fix missing NUL-termination with large strings

* acpi-resource:
  ACPI: resource: Do IRQ override on all TongFang GMxRGxx
  ACPI: resource: Add IRQ overrides for MAINGEAR Vector Pro 2 models

* acpi-apei:
  ACPI: APEI: EINJ: Limit error type to 32-bit width

* acpi-tables:
  ACPI: tables: Add support for NBFT

* acpi-processor:
  cpufreq: intel_pstate: Drop ACPI _PSS states table patching
  ACPI: processor: perflib: Avoid updating frequency QoS unnecessarily
  ACPI: processor: perflib: Use the "no limit" frequency QoS
  ACPI: processor: idle: Drop unnecessary (void *) conversion

* acpi-pnp:
  ACPI: PNP: Introduce list of known non-PNP devices

* acpi-maintainers:
  MAINTAINERS: Add x86 ACPI paths to the ACPI entry

* acpica:
  ACPICA: Fix typo in CDAT DSMAS struct definition
  ACPICA: nsrepair: handle cases without a return value correctly
  ACPICA: Constify pathname argument for acpi_get_handle()
  ACPICA: Drop port I/O validation for some regions

Pull OPP (Operating Performance Points) updates for 6.3 from Viresh
Kumar:

"- Add missing 'cache-unified' property in example for kryo OPP bindings
   (Rob Herring).

 - Fix error checking in opp_migrate_dentry() (Qi Zheng).

 - Remove "select SRCU" (Paul E. McKenney).

 - Let qcom,opp-fuse-level be a 2-long array for qcom SoCs (Konrad
   Dybcio)."

* tag 'opp-updates-6.3' of git://git.kernel.org/pub/scm/linux/kernel/git/vireshk/pm:
  OPP: fix error checking in opp_migrate_dentry()
  dt-bindings: opp: v2-qcom-level: Let qcom,opp-fuse-level be a 2-long array
  drivers/opp: Remove "select SRCU"
  dt-bindings: opp: opp-v2-kryo-cpu: Add missing 'cache-unified' property in example

Pull cpufreq ARM updates for 6.3 from Viresh Kumar:

"- Enable thermal cooling for Tegra194 (Yi-Wei Wang).

 - Register module device table and add missing compatibles for
   cpufreq-qcom-hw (Nícolas F. R. A. Prado, Abel Vesa and Luca Weiss).

 - Various dt binding updates for qcom-cpufreq-nvmem and opp-v2-kryo-cpu
   (Christian Marangi)."

* tag 'cpufreq-arm-updates-6.3' of git://git.kernel.org/pub/scm/linux/kernel/git/vireshk/pm:
  dt-bindings: opp: opp-v2-kryo-cpu: enlarge opp-supported-hw maximum
  dt-bindings: cpufreq: qcom-cpufreq-nvmem: make cpr bindings optional
  dt-bindings: cpufreq: qcom-cpufreq-nvmem: specify supported opp tables
  dt-bindings: cpufreq: cpufreq-qcom-hw: Add SM8550 compatible
  dt-bindings: cpufreq: cpufreq-qcom-hw: Add missing compatibles
  cpufreq: mediatek-hw: Register to module device table
  cpufreq: tegra194: Enable CPUFREQ thermal cooling

of_device_get_match_data() may return NULL, so add a check to prevent
potential null pointer dereference.

Issue reported by Qualcomm's internal static analysis tool.

Fixes: 4f796170 ("cpufreq: qcom-hw: Move soc_data to struct qcom_cpufreq")
Signed-off-by: Manivannan Sadhasivam <manivannan.sadhasivam@linaro.org>
Acked-by: Viresh Kumar <viresh.kumar@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>

Enlarge opp-supported-hw maximum value. In recent SoC we started
matching more bit and we currently match mask of 112. The old maximum of
7 was good for old SoC that didn't had complex id, but now this is
limiting and we need to enlarge it to support more variants.

Document all the various mask that can be used and limit them to only
reasonable values instead of using a generic maximum limit.

Signed-off-by: Christian Marangi <ansuelsmth@gmail.com>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Signed-off-by: Viresh Kumar <viresh.kumar@linaro.org>

The qcom-cpufreq-nvmem driver supports 2 kind of devices:
- pre-cpr that doesn't have power-domains and base everything on nvmem
  cells and multiple named microvolt bindings.
  Doesn't need required-opp binding in the opp nodes as they are only
  used for genpd based devices.
- cpr-based that require power-domain in the cpu nodes and use various
  source to decide the correct voltage and freq
  Require required-opp binding since they need to be linked to the
  related opp-level.

When the schema was introduced, it was wrongly set to always require these
binding but this is not the case for pre-cpr devices.

Make the power-domain and the required-opp optional and set them required
only for qcs404 based devices.

Signed-off-by: Christian Marangi <ansuelsmth@gmail.com>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Signed-off-by: Viresh Kumar <viresh.kumar@linaro.org>

Add additional info on what opp tables the defined devices in this schema
supports (operating-points-v2-kryo-cpu and operating-points-v2-qcom-level)
and reference them.

Signed-off-by: Christian Marangi <ansuelsmth@gmail.com>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Signed-off-by: Viresh Kumar <viresh.kumar@linaro.org>

ACPICA commit 9d8bd58d5f3495ce76d1b9767ec0b92251cbc366

Link: https://github.com/acpica/acpica/commit/9d8bd58d5f34


Signed-off-by: Lukas Wunner <lukas@wunner.de>
Reviewed-by: Ira Weiny <ira.weiny@intel.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>

Apply commit 7592b79b ("ACPI: resource: do IRQ override on XMG Core 15")
override for all vendors using this mainboard.

Signed-off-by: Werner Sembach <wse@tuxedocomputers.com>
Fixes: 9946e39f ("ACPI: resource: skip IRQ override on AMD Zen platforms")
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>

Fix a regression introduced by commit 9946e39f ("ACPI: resource: skip
IRQ override on AMD Zen platforms") on MAINGEAR Vector Pro 2 systems, which
causes the built-in keyboard to not work. This restores the functionality
by adding an IRQ override.

No other IRQs were being overridden before, so this should be all that is
needed for these systems. I have personally tested this on the 15" model
(MG-VCP2-15A3070T), and I have confirmation that the issue is present on
the 17" model (MG-VCP2-17A3070T).

Fixes: 9946e39f ("ACPI: resource: skip IRQ override on AMD Zen platforms")
Signed-off-by: Adam Niederer <adam.niederer@gmail.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>