platform/rdfremont*: different provisioning bundle on different chips

A recent change in chip manufacturing (CM) provisioning bundle per chip
for a multi-chip platform. The CM provisioning bundle for each chip
includes the chip id and other chip specific information.

Update the RD-Fremont variants run scripts to use the chip specific cm
provisioning bundles when pre loading.

Change-Id: Ie0ab50f629c571d338685682f81fd369b9ab957f
Signed-off-by: Vijayenthiran Subramaniam <vijayenthiran.subramaniam@arm.com>